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MANUFACTURING PROCESS

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Huiyang TECHWISE Industrial Technology Co.Ltd

Huiyang Economic Development Zone, Huizhou City, Guangdong Province, China
Tel: (86) 752- 3500078   
Fax: (86) 752- 3500306

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Plant Parameter

TECHWISE(Fogang) Circuits Limited

Kingboard Industry Park, Shi Jiao Town, Fogang Country, Qing Yuan, Guangdong Province, China
Tel: (86) 763- 4296800   
Fax: (86) 763- 4287599

Download the full data :

Plant Parameter

TECHWISE Shirai(Fogang) Circuits Limited

Town South Industry Park, Shi Jiao Town, Fogang Country, Qing Yuan, Guangdong Province, China
Tel: (86) 763- 4201888   
Fax: (86) 763- 4201308

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Plant Parameter

1. Cut to Size, Issue
★ Inner layer/Core shearing

2. Image Transfer/Etching(Inner layer)
★ Inner layer circuit manufacturing
★ Use dry film as etching resist

3. AOI/Test
★ AOI(Automatic Optical Inspection)in place of visual inspection
★ Fine circuit pattern inspection

4. Lamination
★ Copper foil + prepreg + inner layer(thin core)
★ High temperature pressure plus bacuum laminate

5. Drilling
★ With broken & missed drill bit detector
★ Drilling program down load directly from CAD/CAM data

6. Plate Through Hole/Panel Plating
★ Plated to required thickness
★ Connected conductivity between layer to layer

7. Image Transfer (Outer Layer)
★ Use automated exposure machine to transfer image from dry film to laminate surface
★ Expose circuit pattern for plating: dry film cover etching areas as plating resist

8. Pattern Plating
★ Plate 1.0 mil thick Cu
★ Plate 0.3 mil thick tin as etching resist

9. Dry Film Stripping/Etching/Solder Stripping
★ Strip dry film then etch copper area covered by dry film
★ Strip Tin on circuit pattern

10. Open/Short Test
★ Test program down load from CAD/CAM data through network system
★ Test all point to point and isolated patterns function

11. Solder mask
★ LPI(Liquid Photo Imagable)which are UL approved

12. Electroless Nickel/Gold
★ Electroless Nickel & Immersion Gold On Copper

13. Gold Tab Plating
★ Automated Gold Tab Plating (0125-1.5 MICRON) thickness

14. Hot Air Leveling(HAL)
★ Horizontal HAL processing to get solder flatness of SMD pad better and smoothness

15. Outline Finish
★ CNC routing /punch
★ V-cut
★ Edge connector chamfer(20-45 angular)

16. Final Test
★ High voltage 300 VDC OHM double sided test

17. Organic Coatcis
★ organic Coating on Copper

18. Packing
★ Vacuum or popular type