Milestone
1994 　Established TECHWISE Circuits Co.,Ltd.and started to build our modern PCB production plant in China
1995 　We further broadened our business base by acquiring shares in Uniplus Electronics Co. Ltd. (Taiwan)
1996 　Start production capacity in TECHWISE to 230K sq.ft.and acquire ISO 9002, UL Certification.
1997 Established HuiYang Uniplus Technology Ltd. in China (mass lamination).Further expanded the production capacity in TECHWISE to 350K sq.ftper month.Manufacturing processes was well-recognized and approval by 3DFX,ACT,ADAPTEC,AZTECH,COMPAQ, CREATIVE, ENI, HP,QDI,MOTOROLA, SHIRAI
1998 (AIWA, MATSUSHITA,BROTHER, TOSHIBA) VISIONTEK, WKK (NEC),XETEL and other international corporation.
1999 　Expanded the production capacity in TECHWISE to 500K sq.ft./month
2000 　Expanded the production capacity in TECHWISE to 700K sq.ft./month and acquire QS 9000 Certificate Going to expand the production capacity in TECHWISE to 1,000K sq.ft./month and acquire ISO 14000 Certificate
2001 1.A new factory is set up to boost capacity up to 120k sq.metre/month
　　 2.Modification of drilling and PTH & Plating technique makes the　production of PTFE models stand to the requirement.
　　 3.Our acid etching machine is capable of handling 3 mil/3 mil inner layer board with the line width tolerance of ＼10%(minimum board　thickness:4 mil).
　　 4.High Tg (180＜C) material (Getek, BT, etc.) are used for production　of multi-layer boards.
2002 1.A new etching line helps to control the impedance within the tolerance of ＼8%.
　　　2.PTH line can achieve following parametres as 12 mil minimum hloe　diameter, 8:1aspectratio,＼2 mil position accuracy, 40 mil via hole space.
　　　3.Our developing machine is able to deal with a strict requirement of 3 mil solder dam as well as 3 mil solder mask bridge. Also, a semi-automatic exposer with a misregistration tolerance of ＼3 mil is employed in our factory.
　　　4.Suep (Surface Uniform Etching Process) is applied to 3 mil/3 mil outer layer to reduce copper thickness.
2003 1.Implemented ERP system for the company.
　　　2.Installed some more advanced testing and production equipment, such as universal electrical tester.
　　　3.Pin-Lam registration System for lamination, Laser drilling machine, AOI, etc.
　　　4.Enhanced our production capability for PCB with a high layer count up to 24-layer.
　　　5.Started production for Microvia or HDI boards.
　　　6.Our second factory at Fogang, Guangdong, started mass production in early 2003 and had almost full capacity by end of the year.
2004 1.Another phase of expansion for the second factory at Fogang, Guangdong.
　　　2.Fune-tune the ERP system implemented.
　　　3.Plan to build a new factory for HDI products.
　　　4.Further implement the Environmental Management System.
　　　5.Install the horizontal PTH line and horizontal pattern-plating line for the Microvia boards.