|
TECHNOLOGY PARAMETER
Feature |
Year
2006
|
| Monthly
Production Capacity |
2,100,000Sq.ft |
| Layer(Mass
Production) |
2-26
Layers |
| Impedance
Control |
+8% |
| Minimum
Thickness of CCL |
3.5mil(including
copper) |
| Board
Thickness |
6-240mil |
| Copper
Clad Laminate |
FR4
& Halogen Free & CEM-3 &
FR5 & PTFE & Rogers & Getek &
BT & Polyimide FR4(Dciyfree) |
| Inner
Etching |
Min.Line/Space |
3.5mil(A/W) |
| Line Width
tolerance |
+10% |
| Board
Thickness(Min.) |
3.5mil(including
copper) |
| Plating
Hole |
Min.Hole Size |
6mil |
| Aspect
Ratio(max) |
8 |
| Position Accuracy |
+1.5mil |
| Microvia |
Min Hole Size |
4mil |
| Aspect Ration(max) |
1:1
|
| Outer
Etching |
Min.Line Width/Space |
3.5/3.5mil(A/W) |
| Line Width tolerance |
+0.35mil |
| Solder
Mask |
Bridge |
3mil |
| Position Accuracy |
1.5mil |
| Press |
Thickness tolerance |
10% |
| Wrap/Twist |
0.75% |
| Inner
Opening(min) |
(1)4/L:6mil |
| (2)6/L-8/L:7mil |
| (3)8/L
or above:8mil |
| Lead
Time |
| |
Production |
Prototype
& Hot Item |
| Double-sided |
10
days |
1
weeks |
| Multi-layer |
2
weeks |
1.5
weeks |
| |
|
(maximum
production size 3000sq.ft.) |
|
|
