1.Cut to Size, Issue
★Inner layer/Core shearing
2.Image Transfer/Etching(Inner layer)
★Inner layer circuit manufacturing
★Use dry film as etching resist
3.AOI/Test
★AOI(Automatic Optical Inspection)in place of visual inspection
★Fine circuit pattern inspection
4.Lamination
★Copper foil + prepreg + inner layer(thin core)
★High temperature pressure plus bacuum laminate
5.Drilling
★With broken & missed drill bit detector
★Drilling program down load directly from CAD/CAM data
6.Plate Through Hole/Panel Plating
★Plated to required thickness
★Connected conductivity between layer to layer
7.Image Transfer (Outer Layer)
★Use automated exposure machine to transfer image from dry film to laminate surface
★Expose circuit pattern for plating: dry film cover etching areas as plating resist
8.Pattern Plating
★Plate 1.0 mil thick Cu
★Plate 0.3 mil thick tin as etching resist
9.Dry Film Stripping/Etching/Solder Stripping

★Strip dry film then etch copper area covered by dry film
★Strip Tin on circuit pattern
10.Open/Short Test
★Test program down load from CAD/CAM data through network system
★Test all point to point and isolated patterns function
11.Solder mask
★LPI(Liquid Photo Imagable)which are UL approved
12.Electroless Nickel/Gold
★Electroless Nickel & Immersion Gold On Copper
13.Gold Tab Plating
★Automated Gold Tab Plating (0125-1.5 MICRON) thickness
14.Hot Air Leveling(HAL)
★Horizontal HAL processing to get solder flatness of SMD pad better and smoothness
15.Outline Finish
★CNC routing /punch
★V-cut
★Edge connector chamfer(20-45 angular)
16.Final Test
★High voltage 300 VDC OHM double sided test
17.Organic Coatcis
★organic Coating on Copper
18.Packing
★Vacuum or popular type